STATS ChipPAC provides semiconductor back-end manufacturing and technology services.
The company has R&D centers and manufacturing operations in Singapore and Korea, with business operations around the world. Its portfolio covers mobile, communication, compute, consumer, automotive, and industrial semiconductor applications.
Based on the company’s public LinkedIn information, supplied through RevenueBase.
The company serves customers around the world.
Services include package integration design and characterization, R&D, wafer probe and bumping, package assembly, final test, and drop shipment to vendors worldwide.
Source: LinkedIn company description · Retrieved October 13, 2026
The portfolio includes wafer-level packaging, 2.5D/3D, System-in-Package, flip chip, and wire bonding technologies.
Source: LinkedIn company description · Retrieved October 13, 2026
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Open the published source list.RevenueBase prepared this profile from the company’s public LinkedIn information and RevenueBase company data. These source records were retrieved on October 13, 2026. AI helped summarize these sources, with a separate automated check against the source text completed on November 4, 2026. Directory positions use company-contact counts from separate saved list snapshots dated September 15, 2026, September 16, 2026, September 18, 2026, September 19, 2026, September 21, 2026, September 27, 2026, September 28, 2026, September 29, 2026, October 8, 2026, October 9, 2026 and October 11, 2026. How the company lists are built.
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