Wafer dicing
The company supplies wafer dicing and grinding services for diverse market segments.
Source: LinkedIn company description · Retrieved October 13, 2026
Grinding And Dicing Services Inc is a US supplier of wafer dicing and grinding services, serving semiconductor, MEMS, life sciences and other market segments.
The company provides support from NPI through commercial-scale manufacturing. The company serves fab and fabless interests.
Based on the company’s public LinkedIn information, supplied through RevenueBase.
The company supports projects for commercial and military applications.
The company supplies wafer dicing and grinding services for diverse market segments.
Source: LinkedIn company description · Retrieved October 13, 2026
The company lists wafer grinding and thinning among its specialties.
Source: LinkedIn company description · Retrieved October 13, 2026
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RevenueBase prepared this profile from the company’s public LinkedIn information and RevenueBase company data. These source records were retrieved on October 13, 2026. AI helped summarize these sources, with a separate automated check against the source text completed on November 4, 2026. Directory positions use company-contact counts from separate saved list snapshots dated September 16, 2026, September 18, 2026 and September 29, 2026. How the company lists are built.
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